【Production】PCBxPCB.com
| Seq | PROCESS | OPERATION | INSPECTION | REMARKS |
|---|---|---|---|---|
| 01 | Cut Size | ╳ | ||
| 02 | Inner-layer printing | ╳ | or image transfer | |
| 03 | Inner-layer printing | ╳ | ||
| 04 | IPQC | ╳ | IPC 600 CLASS Ⅱ | |
| 05 | Black oxide | ╳ | ||
| 06 | Laminate | ╳ | ||
| 07 | Drilling | ╳ | ||
| 08 | IPQC | ╳ | IPC 600 CLASS Ⅱ | |
| 09 | De-smear & PTH | ╳ | or Black hole | |
| 10 | Image transfer | ╳ | ||
| 11 | Pattern plating | ╳ | ||
| 12 | Etching | ╳ | ||
| 13 | Testing | ╳ | IPC 600 CLASS Ⅱ | |
| 14 | Solder resist printing | ╳ | ||
| 15 | Legend printing | ╳ | ||
| 16 | Gold finger plating | ╳ | ||
| 17 | HAL | ╳ | ||
| 18 | Routting | ╳ | ||
| 19 | Finished product cleaning | ╳ | ||
| 20 | Open-short testing | ╳ | IPC 600 CLASS Ⅱ | |
| 21 | Dying oven | ╳ | ||
| 22 | Final inspection | ╳ | IPC 600 CLASS Ⅱ | |
| 23 | Packing | ╳ | ||
| 24 | Shipping | ╳ |
Info